Detail Design Capabilities
Mechanical Design – From board outline definition to full enclosure
designs, our engineers have experience working with metal or plastic and in industries
from consumer to military. We use 3D, parametric-based CAD systems. Our primary
tool is SolidWorksTM, but through design partners, we can have designs completed
in the CAD package of choice for each customer.
Cooling System Design – System cooling varies widely according
to the power and thermal requirements of the individual application. From simple
PCB thermal pads, to heat-sinks, to fan selection, to complete fantray design, we
can provide the necessary expertise to insure system reliability and safety.
Electrical Circuit Design – Our engineering staff has extensive
experience in both digital and analog design, including everything from single board
design, to embedded system development. Previous designs have implemented processors
and chips from Actel, Altera, AMCC, Cypress, Freescale, Intel, Microchip, Texas
Instruments, Xilinx, and many others.
Component Engineering – Component engineering services include
thru hole to SMT conversions, ROHS compliant conversions, alternate sourcing, and
cost reduction.
Firmware Design – Low-level code for controllers, CPLDs, FPGAs,
and other chips.
PCB CAD Layout – We have experience designing boards from simple
to complex; from 2-46 layers, up to .25” thick, from standard FR-4 to high-performance
materials, including high-temperature and low-dielectric constant materials. Our
main layout tool is Cadence’s Allegro PCB design suite, however, we can also provide
support for Expedition, Pads, and others.